Bionic Non-slip Pad High Friction Low Adhesion Wafers Carry Bionic Friction Pad Suction Cups

Bionic non-slip pad High friction low adhesion wafers carry bionic friction pad suction cups

Bionic anti-slip pad is a high-performance anti-slip tool that mimics biological structures (such as gecko feet, octopus suction cups), and achieves glue-free strong adhesion (effective in both dry and wet environments) and shock absorption buffering through micro-nano surface design. With ultra-clean, anti-static, and extreme temperature resistance, it is designed for precision industries such as photovoltaic, semiconductor, and optoelectronics to significantly improve production yield (such as reducing wafer edge breakage) and reduce maintenance costs. In the future, it will develop in the direction of intelligent, degradable and space applications, and become a key functional material in the high-end manufacturing field.

Bionic anti-slip pad properties

⚫ Storage requirements for components such as wafer and glass: non-slip, no residue, no viscosity, weather resistance, and stability
⚫ Problem solution Technical solution: The interface friction is controlled by biomimetic microstructure to achieve the mechanical characteristics of high friction and low adhesion
⚫ Core technology: bionic micro and nano processing technology, special polymer rubber design and synthesis technology, MEMS manufacturing technology

⚫ has biomimetic micro-nano array structure, showing the contact mechanical properties of high tangential friction and low normal adhesion;
⚫ bionic anti-slip material has excellent interface adaptive properties, which can buffer the ultra-thin brittle interface and reduce the risk of debris;
⚫ Special polymer elastic material for semiconductor field, combined with micro and nano manufacturing technology and MEMS technology, no imprint pollution, reusable.

Technical specifications

Bionic anti-slip pad application

1. Photovoltaic industry
Silicon rod cutting and fixing: non-slip pads are used in diamond wire cutting machines to reduce silicon rod sliding (cutting yield ↑12%).

Component assembly: Flexible bionic pad fixed glass-back laminate structure to avoid EVA film deviation.

Special requirements: UV aging resistance (outdoor life of 25 years), PID resistance (potential induced attenuation) materials.

2. Semiconductor industry
Wafer handling: Vacuum sucker integrates bionic non-slip lines to handle 300mm wafer with zero slip.

Anti-shock of lithography machine: nano-level cushion to reduce table vibration (≤0.1nm amplitude).

Special requirements: Certified by SEMI S2/S8, resistant to plasma corrosion (etching process).

3. Photoelectric industry
Laser optical module: non-slip pad fixed lens group to avoid temperature drift caused by optical path deviation.

Fiber coupling: Bionic adhesive pad accurately fixed fiber array (insertion loss <0.1dB).

Special requirements: high light transmittance (visible light transmittance >90%), anti-laser burn (1064nm power >10kW/cm²).